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quad flat package with J-leads

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  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • Quad Flat No Leads Package — QFN Gehäuse von unten. Am Rand die Anschlusspins, in der Mitte eine Massefläche …   Deutsch Wikipedia

  • QFP — A QFP or Quad Flat Package is an integrated circuit package with leads extending from each of the four sides. It is used primarily for surface mounting (SMD); socketing is rare, and hole mounting is not possible. There are versions having from 32 …   Wikipedia

  • QFN — A QFN or Quad Flat No leads or a MLF package is an integrated circuit package which falls under Surface mount technology packages used on printed circuit boards. This kind of package is similar to the Quad Flat Package, but the leads do not… …   Wikipedia

  • Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

  • Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia

  • Desoldering — Solders can be removed using a vacuum plunger (on the right) and a soldering iron. In electronics, desoldering is the removal of solder and components from a circuit for troubleshooting, for repair purposes, component replacement, and to salvage… …   Wikipedia

  • Business and Industry Review — ▪ 1999 Introduction Overview        Annual Average Rates of Growth of Manufacturing Output, 1980 97, Table Pattern of Output, 1994 97, Table Index Numbers of Production, Employment, and Productivity in Manufacturing Industries, Table (For Annual… …   Universalium

  • Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… …   Wikipedia

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